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| TPN3021 Tripolar overvoltage protection for network interfaces Features Triple crowbar protection Low capacitance Low holding current: IH = 30 mA minimum Surge current: - IPP = 200 A, 2/10 s - IPP = 30 A, 10/1000 s Main applications Dedicated to data line protection, this device provides a tripolar protection function. It ensures the same protection capability with the same breakdown voltage in both common and differential modes. SO-8 Description The TPN3021 is a low capacitance transient surge arrestor designed for protection of high debit rate communication network. Its low capacitance avoids distorsion of the signal as it has been designed for T1/E1 and Ethernet networks. Schematic diagram Rx+ / Tx+ 1 8 NC Benefits Trisil technology is not subject to ageing and provides a fail safe mode in short circuit for a better protection. They are used to help equipment to meet main standards such as UL1950, IEC950 / CSA C22.2 and UL1459. They have UL94 V0 ap-proved resin. SO8 package is JEDEC registered. Trisils comply with the following standards GR1089 Core, ITU-T-K20/K21, VDE0433, VDE0878, IEC61000-4-2. NC 2 7 NC NC 3 6 GND Rx- / Tx- 4 5 NC February 2006 Rev 4 1/8 www.st.com 8 Characteristics TPN3021 1 Table 1. Characteristics Complies with the following standards Peak surge voltage (V) 2500 1000 1500 1000 6000 8000 4000 2000 4000 2000 2000 2000 Voltage waveform 2/10 s 10/1000 s 2/10 s 10/700 s 1/60 ns 10/700 s 1.2/50 s 10/700 s 1.2/50 s Required peak current (A) 500 100 100 25 Current waveform 2/10 s 10/1000 s 2/10 s 5/310 s Minimum serial resistor to meet standard () 7.5 25 0 0 40 0 0 0 0 0 Standard GR-1089 Core First level GR-1089 Core Intrabuilding ITU-T-K20/K21 ITU-T-K20 (IEC61000-4-2) VDE0433 VDE0878 IEC61000-4-5 ESD contact discharge ESD air discharge 100 50 100 50 50 50 5/310 s 1/20 s 5/310 s 8/20 s Table 2. Symbol VRM VBO VBR IH IBO IRM IPP C VR IR Electrical characteristics (Tamb=25C) Parameter Stand-off voltage Breakover voltage Breakdown voltage Holding current Breakover current Leakage current at VRM Peak pulse current Capacitance Continous reverse voltage Leakage current at VR IBO IR IH IRM VRM VR IPP I V VBR V BO 2/8 Rev 4 TPN3021 Table 3. Symbol Characteristics Absolute ratings (Tamb =25C) Parameter 10/1000 s 8/20 s 10/560 s 5/310 s 10/160 s 1/20 s 2/10 s 50 Hz 60 Hz 0.2 s 2s Value 30 100 40 50 75 100 200 8 9 3 1.5 -55 to +150 -40 to +150 260 Unit Ipp Peak pulse pulse current: tr / tp A Non repetitive surge peak on-state current One cycle ITSM Non repetitive surge peak on-state current F=50Hz Tstg Tj TL Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10s A A C C C Repetitive peak pulse current tr : rise time (s) tp: pulse duration time (s) example: pulse waveform 10/1000 s, tr = 10 s, tp = 1000 s % I PP 100 50 0 tr Table 4. Thermal resistances Parameter Junction to ambient Value 170 Unit C/W tp t Symbol Rth(j-a) Table 5. Type Electrical parameters (Tamb = 25C) IRM @VRM max. A V 28 VBO max@IBO (1) max. V 38 mA 300 IH (2) min. mA 30 C(3) typ. pF 16 TPN3021 4 1. See Figure 1: Test circuit 1 for IBO and VBO parameters 2. See Figure 2: Test circuit 2 for IH parameter 3. VR = 0 V bias, VRMS = 1 V, F = 1 MHz Rev 4 3/8 Characteristics Figure 1. Test circuit 1 for IBO and VBO parameters TPN3021 K ton = 20ms R1 = 140 R2 = 240 Vout DUT VBO measurement 1/4 IBO measurement Figure 2. Test circuit 2 for IH parameter Surge generator R Vbat < Vbr D.U.T 4/8 Rev 4 TPN3021 Ordering information scheme Figure 3. Non repetitive surge peak on-state current versus overload duration (Tj initial = 25C) Figure 4. Variation of junction capacitance versus reverse voltage applied (typical values) ITSM(A) 12 10 8 6 4 2 F=50Hz C(pF) 22 20 18 16 14 12 10 8 6 4 2 0 Tj=25C F=1MHz VRMS=1V t(s) 0 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 VR(V) 0 5 10 15 20 25 30 Figure 5. Relative variation of holding current versus junction temperature IH[Tj] / IH[Tj=25C] 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 Tj(C) -20 0 20 40 60 80 100 120 2 Ordering information scheme TPN Tripolar Protection for Network Numerical code Version Package: 1 = SO-8 Plastic Packaging: RL = Tape & reel = Tube 30 2 1 RL Rev 4 5/8 Package mechanical data TPN3021 3 Package mechanical data Table 6. SO-8 (Plastic) dimensions DIMENSIONS REF. Millimetres Min. A a1 a2 b b1 C c1 D E e e3 F L M S 3.8 0.4 4.8 5.8 1.27 3.81 4.0 0.15 0.35 0.19 0.50 45 (typ) 5.0 6.2 0.189 0.228 0.050 0.150 0.157 0.050 0.024 0.197 0.244 0.1 Typ. Max. 1.75 0.25 0.004 1.65 0.48 0.014 0.25 0.007 0.020 Min. Inches Typ. Max. 0.069 0.010 0.065 0.019 0.010 1.27 0.016 0.6 8 (max) In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 Rev 4 TPN3021 Ordering information 4 Ordering information Part number TPN3021 TPN3021RL (1) Marking TPN302 Package SO-8 Weight 0.08 g Base qty 100 2500 Delivery mode Tube Tape and reel TPN302 1. Preferred device 5 Revision history Date Sep 2001 Revision 3 Previous release. Reformatted to current template. Maximum junction temperature parameter replaced by Operating junction temperature range in Table 3. Added footnote 1 to Ordering information table Changes 07-Feb-2006 4 Rev 4 7/8 TPN3021 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Rev 4 |
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